OLED Automatic cutting equipment
Equipment core technical advantages
-UV femtosecond/picosecond laser cutting
-Unique spectroscopic technology to improve cutting efficiency
-Four-axis linkage function
-Line Scan accuracy detection
-The processing platform supports one-click replacement
Equipment application scenarios
-Compatible size 3 ~ 8 inch / 5 ~ 20 inch
-Corresponding to mobile phone screen/tablet screen shape cutting, flexible mobile phone screen camera hole punching, support single hole/double hole/track hole, compatible with three-sided shaped cutting
加工流程
自動(dòng)上料自動(dòng)定位自動(dòng)切割自動(dòng)去廢自動(dòng)Panel去廢自動(dòng)檢查自動(dòng)下料
| 產(chǎn)品 | OLED Pad Cut 3" ~ 8"（70mm×30mm~ 210mm×110mm） |
| TT | ≤4.5 s/ea (8英寸) |
| Up Time Rate | 量產(chǎn)后Uprate≥99%（每天來(lái)料影響的設(shè)備類down機(jī)小于0.5h） |
| MTTR(平均恢復(fù)時(shí)間） | ≤4.5 s/ea (8英寸) |
| MTBF(平均故障間隔時(shí)間） | ≥1000hours |
| 良率 | ＞99.7% |
| 切割精度 | ±30um |
| 熱影響 | ≤30um |
| 產(chǎn)品 | OLED Shape Cut 3寸~8寸(70mm×35mm ~210mm×150mm) |
| TT | ≤4.5 s/ea (8英寸) |
| Up Time Rate | 量產(chǎn)后Uprate≥99%（每天來(lái)料影響的設(shè)備類down機(jī)小于0.5h） |
| MTTR(平均恢復(fù)時(shí)間） | ≤1Hours |
| MTBF(平均故障間隔時(shí)間） | ≥1000hours |
| 良率 | ＞99.7% |
| 切割精度 | ±40um |
| 熱影響 | ≤100um |
| 產(chǎn)品 | OLED Hole Cut 3寸~8寸(70mm×35mm ~210mm×150mm) |
| TT | ≤5.5 s/ea (8英寸，單孔產(chǎn)品) |
| Up Time Rate | 量產(chǎn)后Uprate≥99%（每天來(lái)料影響的設(shè)備類down機(jī)小于0.5h） |
| MTTR(平均恢復(fù)時(shí)間） | ≤1Hours |
| MTBF(平均故障間隔時(shí)間） | ≥1000hours |
| 良率 | ＞99.7% |
| 切割精度 | ±30um |
| 熱影響 | ≤70um |
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