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PRODUCTS SHOW

PRODUCTS SHOW

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OLED Automatic cutting equipment

OLED Automatic cutting equipment

Equipment core technical advantages

-UV femtosecond/picosecond laser cutting

-Unique spectroscopic technology to improve cutting efficiency

-Four-axis linkage function

-Line Scan accuracy detection

-The processing platform supports one-click replacement


Equipment application scenarios

-Compatible size 3 ~ 8 inch / 5 ~ 20 inch

-Corresponding to mobile phone screen/tablet screen shape cutting, flexible mobile phone screen camera hole punching, support single hole/double hole/track hole, compatible with three-sided shaped cutting



加工流程

自動上料自動定位自動切割自動去廢自動Panel去廢自動檢查自動下料

產(chǎn)品OLED Pad Cut  3" ~ 8"(70mm×30mm~  210mm×110mm)
TT≤4.5 s/ea (8英寸)
Up Time Rate量產(chǎn)后Uprate≥99%(每天來料影響的設(shè)備類down機小于0.5h)
MTTR(平均恢復(fù)時間)≤4.5 s/ea (8英寸)
MTBF(平均故障間隔時間)≥1000hours
良率>99.7%
切割精度±30um
熱影響≤30um



產(chǎn)品OLED Shape Cut  3寸~8寸(70mm×35mm ~210mm×150mm)  
TT≤4.5 s/ea (8英寸)
Up Time Rate量產(chǎn)后Uprate≥99%(每天來料影響的設(shè)備類down機小于0.5h)
MTTR(平均恢復(fù)時間)≤1Hours
MTBF(平均故障間隔時間)≥1000hours
良率>99.7%
切割精度±40um
熱影響≤100um


產(chǎn)品OLED Hole Cut  3寸~8寸(70mm×35mm ~210mm×150mm) 
TT≤5.5 s/ea (8英寸,單孔產(chǎn)品)
Up Time Rate量產(chǎn)后Uprate≥99%(每天來料影響的設(shè)備類down機小于0.5h)
MTTR(平均恢復(fù)時間)≤1Hours
MTBF(平均故障間隔時間)≥1000hours
良率>99.7%
切割精度±30um
熱影響≤70um



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